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For plating applications copper is commonly used as an under plating to enhance adhesion of deposits, improve electrical properties, impair migration of alloying elements into the final plated deposit or to improve corrosion resistance of the overall deposit. As a final deposit, copper plating services are used for enhancing the brazing, thermal or electrical conductivity of substrate materials, as a high temperature lubricant, as a heat treatment stop-off or for jacketing of projectiles. Copper can be plated matte to bright and with a wide range of deposit hardness and ductility.
SPECIFICATION | ||
Coating film technical data | Curing conditions | 180°C/20min |
Impact resistance(drop hammer) | 50kg.cm pass | |
Pencil hardness | H-2H | |
60°gauge head Gloss | High gloss type≥85% Semi gloss type:51-84% | |
Adhesion(cross cut test) | 1mm 6x6 0 grade | |
Bending test(tapering spindle) | 3mm pass | |
Salt Spray Testing | >500 hours | |
Humidity resistance | >1,000 hours | |
Application recommendation | Application Voltage | 60-80KV |
Film Thickness | 60-80 Micron | |
Average coverage | 8-12 square meters/kg, thickness 60μm(100% of the powder coating utilization rate) |